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Imagination Delivers High-Quality IP Cores with Energy Efficiency using Verisium and Xcelium
McLaren and Cadence Engineering Success in Formula 1
Orca Semiconductor Optimizes Analog ICs with Cadence Tools in the Cloud
Kalray Is Pioneering DPU Development with AI-Based Cadence Tools
Switch Provides Unparalleled Exascale Data Center Solutions with Cadence and NVIDIA
Socionext Is Tackling Large-Scale SoC Designs with Cadence Certus, Quantus, and Tempus Solutions
NV5, NVIDIA and Cadence Collaboration Optimizes Data Center Efficiency, Performance and Reliability
MaxLinear Integrates Analog/Digital Design into One Chip with Clarity 3D and EMX Planar 3D Solvers
Thésée DataCenter Provides Energy-Efficient Colocation Hosting with Cadence Reality DC Digital Twin
Honda Propels Forward in the EV and eVTOL Race with Cadence CFD
MediaTek Is Optimizing Signal Integrity Design with Cadence Optimality and Clarity 3D Solver
Wiwynn Provides Energy-Optimized Data Center IT Solutions from Cloud to Edge with Cadence Optimality
SimVision SystemC/C/C++ Debug with HDL
SystemVerilog Assertions SVA first match Operator
Understanding strong and weak SVA operators
SystemVerilog Classes 6: Virtual Methods and Classes
Creating Inter Layer Checks available in the Constraint Manager from with the Allegro PCB Editor
Debugging an AXI/DDR4 Bridge with Indago Protocol Debug App
The Cadence vManager Metric-Driven Signoff Platform in Use at NXP
SystemVerilog Classes 1: Basics
Why Consider SystemVerilog for Synthesizable RTL
Hardware Description Language IntroductionApplications of Configuration in VHDL
Cadence and Arm server chip collaboration
Reduce Analog and Mixed-Signal Design Risk with a Unified Design and Simulation Solution
Fairchild Semiconductor Eases Floorplanning Challenges of Mixed-Signal Design with Virtuoso Platform
Data Center Solution for Enterprise Data Centers
Silicon Photonics Summit: Paul McLellan's Breakfast Buffet November
AI for image classification and object recognition
Software and System Verification – Cadence Helium, Palladium Emulation and Protium FPGA prototyping
The Cadence Digital Full-Flow for SoC Design and Implementation
Regular Expressions in UVM Configurations
Migrating OrCAD Capture Designs to Allegro System Capture
ams Reduces IC Development Effort by Collaborating with Cadence on Layout Productivity
Introduction to the Constraint Manager User Interface
ADAS and Edge Computing with AI using Tensilica Vision DSPs
DATE2023 Recap
PSpice for TI Overview
Meet the Recipients of Cadence’s 2023 Black Students in Technology Scholarship
UVM Phase Callbacks and Hook Methods
Developing Subcircuit Models using PSpice Model Editor
Basic Static Timing Analysis: Setting Timing Constraints
Designing with Integrity 3D-IC
Data Center Digital Twin Solution
Data Center Solution for Data Center Consultants
Introduction to Customer-Managed Cloud Passport
Employee Spotlight: Preeti Maheshwari
Penn Electric Racing Revs Up Competition with Celsius Thermal Solver and AWR RF/Microwave Design
Recogni Is Making AI-Based Vision Inference Chips with Cadence Tools on Google Cloud
Redefining signal and power integrity
Introduction to OrCAD X Presto User Interface
What's New In Voltus IC Power Integrity Solution - SSV21.1
Electromagnetic Simulation of Large Chip-Package Designs Using Clarity 3D Solver
SystemVerilog bind Construct
Power Signoff for 28-nm FD-SOI at STMicroelectronics
Accelerate Time to Market for Power Integrity Signoff
Get Your Projects Back on Track with vManager Verification Management
Using SVA Coverage to Debug SVA Assertions
What's New in Voltus IC Power Integrity Solution - SSV 22.11