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Bonding Hybrid Multilayer Constructions for High Frequency Applications

Опубликовано: 19 Май 2021
на канале: Rogers' Advanced Electronics Solutions
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I-Connect 007: Real Time with... John Ekis, Rogers Corporation

John Ekis, Rogers Corp. Market Segment Director - Aerospace and Defense, discusses the SpeedWave™ family of low dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions.

Learn more about Rogers Advanced Connectivity Solutions at https://www.rogerscorp.com

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